张永谦Zhang Yongqian智能芯片解决方案事业部总经理 资深半导体行业专家 前德州仪器半导体深港大区总经理 GM of AIoT IC Solutions Product Line, Horizon Robotics Senior Semiconductor Expert Former GM of Texas Instruments Semiconductor Technologies Shenzhen-Hong Kong Area

张永谦,地平线智能芯片解决方案事业部总经理,中国半导体行业资深商业专家,现在地平线负责AIoT智能芯片解决方案业务方向。 在加入地平线(Horizon Robotics)前,张永谦曾任德州仪器深港大区总经理,拥有12年的市场销售经验,管理全国业务最大的区域,年业务额近6亿美金,推广 TI 从嵌入式处理器到模拟的完整解决方案,涵盖AIoT、汽车电子、工业及消费类市场应用。

演讲主题:

边缘AI芯片赋能行业,共建普惠AI时代

Theme of the speech:

 Edge AI Chip Empowers the Industry to Build the Inclusive AI Age




演讲内容:

面对AI新时代的到来,边缘计算如何在应对终端数量激增和海量数据计算挑战起到关键作用;重点分享边缘计算AI芯片的发展方向和前景展望,以及如何依托于算法+芯片结合的双重优势,赋能行业客户,打造极致性价比的边缘AI芯片和解决方案;同时介绍如何打造完整生态体系,与客户一起步入普惠AI新时代。

speech content:     

At the advent of new AI age, how edge computing plays a crucial role in coping with the challenges from the booming devices and huge data computing; mainly share the development direction and outlook of edge computing AI chip, and how to leverage the dual advantages of algorithm and chip to empower the industrial clients and build the extremely cost-effective edge AI chips and solutions; in the meantime, introduce how to build an integrated ecosystem and welcome the inclusive new AI age together with the clients.




公司简介:

地平线具有领先的人工智能算法和芯片设计能力,通过软硬结合,设计开发高性能、低成本、低功耗的边缘人工智能芯片 及解决方案,开放赋能合作伙伴。面向智能驾驶和AIoT,地平线可提供超高性价比的边缘AI芯片、极致的功耗效率、开放 的工具链、丰富的算法模型样例和全面的赋能服务。

目前,基于创新的人工智能专用计算架构BPU(Brain Processing Unit) ,地平线已成功流片量产了中国首款边缘人工智 能处理器⸺专注于智能驾驶的“征程(Journey)”系列处理器和专注于AIoT的“旭日(Sunrise)”系列处理器,并已大规模 商用。此外,基于BPU2.0架构的地平线Matrix自动驾驶计算平台屡获国际大奖(如:2019美国CES创新奖、2019 Embed- ded Vision Alliance“最佳汽车解决方案”奖等),得到了众多专业机构的认可。

依托行业领先的软硬结合产品,地平线向行业客户提供“芯片+算法+云”的完整解决方案。在智能驾驶领域,地平线同全 球四大汽车市场(美国、德国、日本和中国)的业务联系不断加深,目前已赋能合作伙伴包括奥迪、博世、长安、比亚迪、上汽 、广汽等国内外的顶级 Tier1s,OEMs 厂商;而在AIoT领域,地平线携手合作伙伴已赋能多个国家级开发区、国内一线制造 企业、现代购物中心及知名品牌店。

company profile:

Horizon Robotics has the leading AI algorithms and chip design capabilities. Leveraging the company’s deep know-how optimizing the software-hardware union, it has independently designed high-performance, low-power and cost-effective edge AI chips and solutions that empowers our partners in smart mobility and AIoT. To accelerate our partners’time-to-market, the company also offers edge AI chips, open toolchain, rich sets of pre-trained model examples, and comprehensive services.

Based on innovative AI processor architecture Brain Processing Unit (BPU), Horizon Robotics has launched its first generation world-leading edge AI processor ‒ Journey processor for smart mobility, and Sunrise processor for AIoT edge computing, both being commercialized on a large scale.In addition, Horizon Matrix Autonomous Driving Computing Platform based on its BPU2.0 architecture has won many awards and honors, such as CES 2019 Innovation Award, 2019 Embedded Vision Alliance ‒ Best Auto Solution Award, a proof of recognition by professional organizations.

Relying on its industry-leading products that uniquely integrate software and hardware, Horizon Robotics pro- vides customers in the industry with a complete solution of“processor + algorithm +cloud”. In terms of smart mobility, Horizon Robotics has been deepening business ties with the top four global automotive markets (Unites States, Germany, Japan and China), and has so far empowered a large number of domestic and foreign top Tier-1s and OEMs, such as Audi, Bosch, Chang’an, BYD, SAIC Motor and GAC Group. In terms of AIoT, such as Smart City, Smart Retail and Smart Robot, Horizon Robotics, in cooperation with partners, has empowered mul- tiple first-line manufacturing enterprises, modern shopping centers and well-known brand stores in China.





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